| Item | Sub-item (FR-4) | Capability | Remarks | Illustration | |||
|---|---|---|---|---|---|---|---|
| Finished Product |
Layer Count | 1~20 Layers | 1+4+1 Structure HDI |
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| HDI | 1~3 Order | Mechanical or laser blind via | |||||
| Board Thickness | 0.6~3.2mm | Board thickness depends on layer count; see order page for details | T(Thickness) |
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| Board Thickness Tolerance | Thickness ≥ 1.0mm | ± 10% | |||||
| Thickness < 1.0mm | ± 0.1mm | ||||||
| Max Finished Board Size | Single/Double-sided, 4-layer | 520×600mm | |||||
| ≥ 6-layer | 400×500mm | ||||||
| Min Finished Board Size | Non-OSP Board | Area ≥ 5m², ≥ 50×50mm | |||||
| Area < 5m², ≥ 10×10mm | |||||||
| OSP Board | ≥ 80×50mm | Equipment limitation, industry standard | |||||
| Tooling Edge | ≥ 3mm | Tooling Edge |
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| Metal Edge Plating | Supported | Metal Edge |
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| Half-hole Process | Supported | ||||||
| Via-in-Pad (POFV) | Supported | Resin FillPla ting |
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| Blind Via Fill Plating | Supported | Plated Cu Fill Blind Via |
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| Material | Substrate | Material | FR-4 | ||||
| Brand | ShengYi, KT, GDM, etc. | ||||||
| Grade | Grade A | ||||||
| Tg Value | 130°C / 150°C / 170°C | ||||||
| CTI Value | ≥ 175V | ||||||
| Breakdown Voltage | ≥ 4000V | ||||||
| Flammability Rating | UL-94 V0 | ||||||
| Drilling | Round Hole | Mechanical Drilling | 0.15mm ≤ Hole Dia. ≤ 6.35mm | When > 6.35mm, routing available | |||
| Laser Drilling | 0.075mm ≤ Hole Dia. ≤ 0.15mm | When > 0.15mm also available, but mechanical drilling is more cost-effective | |||||
| Slot Hole | Plated Slot | ≥ 0.50mm | Slot Types |
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| Non-plated Slot | ≥ 0.80mm | ||||||
| Half-hole | Half-hole Diameter | ≥ 0.5mm | Half-hole Dia.≥0.5mm Spacing≥0.9mm |
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| Half-hole Spacing | ≥ 0.9mm | Distance between half-holes | |||||
| Aspect Ratio | 12 : 1 | Ratio of board thickness to hole diameter | |||||
| Hole Position Tolerance | ± 0.075mm | Drilling position deviation | |||||
| Hole Diameter Tolerance | PTH (Standard) | ± 0.075mm | Ideal Circle CenterDrilling Position OffsetData Position OffsetHole Dia. Deviation = a+b |
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| PTH (Press-fit) | ± 0.05mm | ||||||
| NPTH | ± 0.05mm | ||||||
| Slot | ± 0.1mm | ||||||
| Plating | Base Copper Thickness (OZ) | Inner Layer | 0.5 ~ 4 | Outer Cu FoilInner Cu FoilOuter Cu FoilL1 L2 L3 L4 L5 L6 |
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| Outer Layer | 1 ~ 4 | ||||||
| Plated Cu Thickness (μm) | ≥ 20 | Considering copper loss, standard impedance calculation uses 0.5OZ (18μm) | |||||
| Hole Copper Thickness (μm) | Through Hole | Avg. Cu Thickness ≥ 20 | Refer to IPC Class 2; other standards like IPC Class 3 require process review | ||||
| Mechanical Blind Via | Avg. Cu Thickness ≥ 20 | ||||||
| Via Fill Plating (μm) | Dimple (Blind Via Concavity) | ≤ 15 | Required only for blind vias that need to be filled flat | ↑hh: dimple value, concavity of blind via |
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| Pattern Transfer |
Trace Width Tolerance | ± 20% | |||||
| Min Inner Trace Width/Spacing | Cu 0.5OZ (18μm) | ≥ 2.5 / 3.0 mil | Typically, min trace width/spacing is inversely proportional to copper thickness | BGA Pad Pitch |
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| Cu 1OZ (35μm) | ≥ 3.0 / 3.0 mil | ||||||
| Cu 2OZ (70μm) | ≥ 5.5 / 5.5 mil | ||||||
| Min Outer Trace Width/Spacing | Cu 1OZ (35μm) | ≥ 3.0 / 3.0 mil | |||||
| Cu 2OZ (70μm) | ≥ 5.5 / 5.5 mil | ||||||
| Min Grid Trace Width/Spacing | Cu 1OZ (35μm) | ≥ 6.0 / 6.0 mil | |||||
| Cu 2OZ (70μm) | ≥ 10 / 10 mil | ||||||
| Min Annular Ring | Cu 1OZ (35μm) | Via | ≥ 3.5mil | Annular ring is a closed trace; min annular ring is similar to min trace width, inversely proportional to copper thickness | Min Annular Ring |
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| Component Hole | ≥ 8mil | ||||||
| Cu 2OZ (70μm) | Via | ≥ 4.5mil | |||||
| Component Hole | ≥ 10mil | ||||||
| BGA Pad Diameter | HASL | ≥ 10mil | For rectangular pads, use the shortest side as reference | ||||
| ENIG | ≥ 8mil | ||||||
| Min BGA Pad Pitch | ≥ 0.45mm | ||||||
| Impedance | > 50Ω Tolerance | ± 10% | |||||
| ≤ 50Ω Tolerance | ± 5Ω | ||||||
| Single-ended Impedance | ≤ 75Ω | ||||||
| Differential Impedance | ≤ 150Ω | ||||||
| Dielectric Constant of Dielectric Layer (Theoretical Ref.) | 4.2 | ||||||
| Dielectric Constant of Solder Mask (Theoretical Ref.) | 3.5 | ||||||
| Solder Mask |
Color | Green, Blue, Red, Yellow, White, Black, Matte Black | Other colors or blue tape process require process review | ||||
| Ink Thickness on Traces | 15 ± 10μm | ||||||
| Solder Mask Opening | ≥ 1.5mil | Solder mask colors available: Green/Blue/Red/Yellow/White/Black etc. Green Blue Red Yellow |
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| Solder Mask Bridge | Green ink: ≥ 3.5mil White/Black ink: ≥ 5mil Other color ink: ≥ 4mil | ||||||
| Via Treatment Methods | Via Coverlay, Via Opening, Via Plugging (Aluminum/Ink plug), Resin Plugging | (1) Appearance: Via plugging looks similar to via coverlay, but provides better insulation. (2) Resin plugging: Usually hard to distinguish visually; ink plugging can partially substitute resin plugging. |
Via Opening Via Ink Plugging |
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| Via Plugging | Plugging Hole Diameter | 0.2mm < Hole Dia. ≤ 0.45mm | Out of range risks plugging defects; within range is industry standard | ||||
| Legend | Legend Color | Color | White, Black | Other colors like yellow require process review | |||
| Etched Legend | Width/Height | ≥ 4mil / 25mil | C82Min Height 25milMin Width 4mil |
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| Silkscreen Legend | Cu 1OZ (35μm) | Width/Height | ≥ 5mil / 30mil | If silkscreen area is flat without steps, use minimum limits | |||
| Cu 2OZ (70μm) | Width/Height | ≥ 7mil / 42mil | |||||
| Cu 3OZ (105μm) | Width/Height | ≥ 12mil / 50mil | |||||
| Inkjet Legend | Width/Height | 0.075mm / 0.6mm | |||||
| Surface Finish |
Surface Finish Type | Lead/Lead-free HASL, ENIG, OSP, Electrolytic Ni/Au | Note: Due to cost, Electrolytic Ni/Au requires minimum order quantity and is not a standard option | ENIG HASL OSP |
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| Plating Thickness (Micro-inch) | ENIG | Nickel Thickness | 100~200 | (1) 1 micro-inch = 0.0254μm; (2) Different gold thicknesses represent different prices due to gold cost |
Ni Layer Cu Layer Au LayerENIG/Electrolytic Ni/Au |
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| Gold Thickness | 1~3 | ||||||
| Electrolytic Ni/Au | Nickel Thickness | 120~200 | |||||
| Gold Thickness | 1~10 | ||||||
| ENIG | Min Distance Between Gold Fingers / Pads in Customer Artwork | ≥ 5mil | To avoid issues like gold bleeding | ||||
| Profiling | Outline Tolerance | ± 0.15mm | Industry standard is ± 0.2mm | ||||
| Trace to Board Edge Distance | CNC Routing | ≥ 0.20mm | →Trace to Edge Dist. ≥ 0.2mm |
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| V-cut | Angle | 30°, 45°, 60° | AngleRemainingRemainingV-cut |
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| Max V-cut Score Count | ≤ 30 scores | ||||||
| Outline Width | 60mm ≤ Width ≤ 480mm | ||||||
| Remaining Thickness | 0.25~0.5mm | ||||||
| Remaining Thickness Tolerance | ± 0.1mm | ||||||
| Gold Finger Bevel | Bevel Board Thickness | 0.8~2.0mm | GF Bevelθ h |
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| Bevel Dimensions | Bevel Length | 30~280mm | |||||
| Bevel Height | ≥ 40mm | ||||||
| Bevel Angle | 20°30' 45° 60° | ||||||
| Bevel Angle Tolerance | ± 5° | ||||||
| Bevel Depth Tolerance | ± 0.15mm | ||||||
| E-Test | Test Points | Flying Probe Test | Unlimited | ||||
| Fixture Test | < 14000 points | Equipment limitation, industry standard | |||||
| IC & BGA Size | ≥ 8mil | Pads too small make probe detection difficult | |||||
| FQC | Warpage | 0.75% | If only through-hole components, industry standard is 1.5% | Flatness Warpage hWarpage = h/L |
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| Others | Delivery Format | Single PCS Delivery | Supported | Single PCS Panel |
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| Panel (per set) Delivery | Supported | ||||||
| Panelization Type | Zero-gap Panelization | Supported | Suitable for regular shapes like square, rectangle | ||||
| Gapped Panelization | Gap > 1.6mm, Supported | Suitable for irregular but straight-edged shapes like pentagon, hexagon | |||||
| Mouse Bite Panelization | Supported | Suitable for curved outlines like circular, elliptical | |||||
| Delivery Report | Standard Delivery Report | Supported | |||||
| Microsection Report | Supported | ||||||
| Impedance Test Report | Supported | ||||||
Design Software
| Software Name | Issue | Notes | Description | Illustration |
|---|---|---|---|---|
| PADS | Copper Pour Issue | Factory defaults to Hatch pour; recommend specifying pour method before ordering | ||
| 2D Lines | Effective lines cannot be placed in the corresponding layer as 2D lines, and Shengyu Circuit does not handle 2D lines | |||
| Altium Designer / Protel | Version Issue | Different versions may output different Gerber elements; please note the version number | Opening on Solder Layer |
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| Opening Issue | Please avoid mistakenly placing the window of the solder layer on the paste layer, as Shengyu Circuit does not handle the paste layer | |||
| Copper Pour Issue | Fill pour or excessive Fill may cause output file loss; use Polygon Pour instead | |||
| Out-of-board Objects | Components placed far outside the PCB may cause output failure due to oversized dimensions |
4-Layer Stack-up Structure
PCB Thickness:
0.6mm
0.8mm
1.0mm
1.2mm
1.6mm
2.0mm
Inner Cu Thickness:
1oz
0.5oz
6-Layer Stack-up Structure
PCB Thickness:
1.0mm
1.2mm
1.6mm
2.0mm
Inner Cu Thickness:
1oz
8-Layer Stack-up Structure
PCB Thickness:
1.2mm
1.6mm
2.0mm
Inner Cu Thickness:
1oz